GOEPEL USA introduces the new x-ray inspection system software OptiCon XI-Pilot 3.0. This major update of the software package running on OptiCon X-Line 3D x-ray inspection systems enables higher image recording speed at increased sensitivity. Additionally, new features were added such as PCB warpage compensation and an enhanced automatic stability control of the image sets.
Spacial Correction of PCB Deflection with OptiCon X-Line 3D
A true height-reconstruction of PCB layers in which solder joints are situated is a prerequisite for solder joint analyses. 3D x-ray inspection (AXI) systems must detect and compensate for PCB warpage or wavy surfaces to avoid false calls or escapes.
GOEPEL utilizes a method, which detects (and compensates for) PCB sag during the inspection process. The result is a true to height solder layer reconstruction for high-quality evaluation of solder joints. Based on PCB condition it is possible to select whether compensation should be applied to the entire assembly or to specific zones.
For PCB warpage determination, a laser triangulation sensor can be applied. It is also possible to compensate for PCB sag directly in the recorded images with software algorithms.
Automatic Stability Monitoring of X-ray Image Sequence
In general, an x-ray inspection system's imaging components include a source for x-ray emission and a detector for converting radiation, weakened by the UUT (unit-under-test), into visible light.
Natural ageing processes of these components change grey values in the x-ray images, which may lead to inaccuracies in algorithmic evaluation of solder joints. OptiCon X-Line 3D automatically detects changes in the x-ray image chain and re-calibrates the imaging chain, ensuring constant image quality and reliable inspection results.
Contact GOEPEL USA to learn more about OptiCon X-Line 3D and OptiCon XI-Pilot 3.0.