As an essential component of the latest version v3.1 of its X-ray inspection software XI-Pilot, GOEPEL introduces a new module for easier evaluation of x-ray images. The innovative new feature, topoVIEW™, facilitates the interpretation of recorded x-ray images with respect to better fault assessment and classification.
topoVIEW construes every single grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed at a higher position in a "topological map view" than less thick PCB materials (light grey values). In this way, defects such as lifted leads, shorts, non-soldering, as well as insufficient or too much solder are displayed graphically for easy interpretation. Especially for users, the new software module simplifies the entry into the world of Automated X-Ray Inspection. For proper interpretation of x-ray images, the x-ray’s physics must be considered in order to understand what is captured. X-ray images show the x-rays’ diminished strength depending on the thickness and density of the radiated material. Highly absorbent materials – thick and dense substances – are displayed as dark areas in digital x-ray images. Weakly absorbing materials – thin and less dense substances – are displayed as light areas. By contrast with an AOI image, an x-ray image does not show reflections or shadows but rather the differences of the materials in terms of their thickness and densities.
topoVIEW is an integral part of the operating software on GOEPEL's 3D AXI system OptiCon X-Line 3D.