News

Test Strategy for IoT Devices receives Embedded World 2016 Award

At Embedded World 2016 in Nuremberg, JEDOS (GOEPEL’s test and diagnostics tool for electronic assemblies) received the embedded Award 2016 in the tools category.

With the Embedded Award, a high-ranking jury with representatives from science research, industry, and media recognizes innovative products and solutions that advance the industry of embedded systems and the IoT (Internet of Things) in outstanding ways. 
The award ceremony took place during a press conference by Prof. Matthias Sturm, Chairman of the Advisory Board of the embedded world, and Dr. Roland Fleck, Managing Director of Nürnberg Messe on the first day of Embedded World.

“We are proud of the high recognition our JEDOS test and diagnostic tool enjoys. Winning this award shows us that with our integrated technology platform we’re on the right track”, says Thomas Wenzel, Managing Director of the JTAG/Boundary Scan division of GOEPEL electronic, after accepting the award. “By integrating embedded diagnostics test and JTAG/boundary scan, we are addressing the latest test challenges posed by complex electronic designs, such as Internet of Things components.”

First introduced in 2015, JEDOS is a platform for high-quality embedded tests of complex electronic design. JEDOS offers a variety of functions for test, validation, calibration, and device programming. Using the native processor, diagnostic functional tests can be performed in real time. A key advantage of JEDOS is the possibility to fully test IoT components without the use of firmware. By integrating of boundary scan and functional embedded test and diagnostics, dependable test and fault coverage can be achieved. As a result, firmware and software engineers can benefit from pre-verified prototype hardware, making their development and debug work more efficient.

To learn more about JEDOS, please view this webinar or contact GOEPEL.

GOEPEL presents Embedded System Access (ESA) Technology at ITC 2015

Key elements of current & future Application Specific Standard Product (ASSP) designs include large, fast memory, (multi-) core processors, wired and/or wireless networking, high-speed communication interfaces, graphical control and display features, as well as sensors and actors (MEMS). All of these elements require advanced test techniques, if for no other reasons than diminishing test access: paradigm change - transparent

 

GOEPEL presents a number of test techniques under the umbrella of Embedded System Access (ESA) technologies at this year's International Test Conference (ITC) in Anaheim, CA. Visit us at booth #219 to learn more about technologies for high-speed memory test, high-speed in-system programming, FPGA assisted testing, processor emulation test, and embedded real-time diagnostics.

New mixed-signal JTAG I/O module

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CION LX module FXT96 At International Test Conference (ITC) 2014 in Seattle, GOEPEL Electronics introduced the CION-LX Module/FXT96, a new mixed-signal JTAG I/O module enabling boundary-scan based tests to non scannable circuit components such as connectors, clusters, or analog interfaces.

CION-LX Module/FXT96 supports test standards such as IEEE 1149.1, IEEE 1149.6, and IEEE 1149.8.1. The module provides 96 single-ended, 12 High Current, and 24 differential test channels. Each channel is bi-directional and their parameters can be configured. Unique in the industry, dynamic test resources such as frequency counter, event detector, arbitrary waveform generator and digitizer are available. This new module is based on CION-LX™, a JTAG controllable Mixed Signal Tester-on-Chip (ToC), developed by GOEPEL electronics.

“We set entirely new standards with the new CION-LX Module/FXT96 in regards to flexibility and functionality of JTAG controlled I/O modules”, says Heiko Ehrenberg of GOEPEL Electronics USA. “We can offer our customers a simple, safe, and affordable solution to enhance their boundary-scan application significantly. With the test resources available per channel, both static and dynamic at-speed-tests are possible – which means significant improvement of structural test coverage and even more flexible test strategies for our customers.”

CION-LX Module/FXT96 can be connected to any Test Access Port (TAP) and can be cascaded to increase the number of channels. It can be operated in combination with other CION modules™ or ChipVORX modules™. Using the boundary-scan software platform SYSTEM CASCON™ a comprehensive automation of the entire project development is possible with minimal effort. Detected errors can be immediately displayed graphically in the PCBA layout with the Scan Vision™ tools. CION-LX Module/FXT96 can be used both for prototype test in the laboratory as well as in production.