3D AOI without compromises

New and innovative 3D-AOI from GOEPEL electronic

This webinar recording discusses the latest developments in the field of 3D AOI measurement of components and solder joints of printed board assemblies. The webinar demonstrates how current procedures and technologies are suitable for use in solder paste inspection, but not completely adequate for inspection of printed circuit board assemblies. In particular, the shadow effects of high components and the high density of assemblies limit the use of the well-known triangulation technology for this application.

Through the use of practical examples, the limitations of fringe projection, Moiré and others for the inspection of printed circuit board assemblies are shown and the advantages of a new tele-centric and shadow-free measurement method will be introduced. Decades of experience in optics and Automatic Optical Inspection (AOI) merge to form a new and revolutionary m

easurement method which will redefine the standards for the future.

Contents of the webinar recording:  - Presentation of the concept of triangulation as the previous predominant measurement method - Pros and cons of fringe projection, Moiré and others - Principle of chromatically coded topography measurement - System concept of GÖPEL 3D AOI - Comparison of different methods/technologies including strengths and weaknesses

To learn more about 3D AOI or other automated optical inspection systems from GOEPEL, please visit or contact us.


AXI + AOI = AXOI, a formula for 100% optical inspection

This webinar recording discusses the use of a combined X-ray and AOI approach for IPC compliant inspection of solder joints on electronic assemblies. The webinar shows why X-ray inspection should be used for testing of all solder joints of an assembly, and not only for partially concealed solder joints. Furthermore, possibilities and limits of error detection will be shown by many image examples.

Following questions were answered during the webinar: • When is the use of double-sided inspection reasonable? • What are the possibilities of double-sided inspection of SMD and THT assemblies? • How can these AOI systems effectively be integrated into the company-specific production? • How can the traceability of assemblies be ensured?

Contents of this webinar recording: • X-ray inspection (AXI) compared to Automatic Optical Inspection (AOI) • Possibilities and limits of error detection by an AXI system • Combination of AXI and AOI test methods • Error scenarios on QFN-, BGA-, THT-, SO-IC and QFP designs • System concept OptiCon X-Line 3D

To learn more about AXOI or other automated optical inspection systems from GOEPEL, please visit or contact us.