X-Ray Inspection

AXI + AOI = AXOI, a formula for 100% optical inspection

This webinar recording discusses the use of a combined X-ray and AOI approach for IPC compliant inspection of solder joints on electronic assemblies. The webinar shows why X-ray inspection should be used for testing of all solder joints of an assembly, and not only for partially concealed solder joints. Furthermore, possibilities and limits of error detection will be shown by many image examples.  


Following questions were answered during the webinar: • When is the use of double-sided inspection reasonable? • What are the possibilities of double-sided inspection of SMD and THT assemblies? • How can these AOI systems effectively be integrated into the company-specific production? • How can the traceability of assemblies be ensured?

Contents of this webinar recording: • X-ray inspection (AXI) compared to Automatic Optical Inspection (AOI) • Possibilities and limits of error detection by an AXI system • Combination of AXI and AOI test methods • Error scenarios on QFN-, BGA-, THT-, SO-IC and QFP designs • System concept OptiCon X-Line 3D

To learn more about AXOI or other automated optical inspection systems from GOEPEL, please visit www.goepelusa.com or contact us.

New software module topoVIEW facilitates enhanced evaluation of X-Ray images

TopoView Example image; click to enlarge As an essential component of the latest version v3.1 of its X-ray inspection software XI-Pilot, GOEPEL introduces a new module for easier evaluation of x-ray images. The innovative new feature, topoVIEW™, facilitates the interpretation of recorded x-ray images with respect to better fault assessment and classification.

topoVIEW construes every single grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed at a higher position in a "topological map view" than less thick PCB materials (light grey values). In this way, defects such as lifted leads, shorts, non-soldering, as well as insufficient or too much solder are displayed graphically for easy interpretation. Especially for users, the new software module simplifies the entry into the world of Automated X-Ray Inspection. For proper interpretation of x-ray images, the x-ray’s physics must be considered in order to understand what is captured. X-ray images show the x-rays’ diminished strength depending on the thickness and density of the radiated material. Highly absorbent materials – thick and dense substances – are displayed as dark areas in digital x-ray images. Weakly absorbing materials – thin and less dense substances – are displayed as light areas. By contrast with an AOI image, an x-ray image does not show reflections or shadows but rather the differences of the materials in terms of their thickness and densities.

topoVIEW is an integral part of the operating software on GOEPEL's 3D AXI system OptiCon X-Line 3D.

Automated 3D X-Ray Inspection of Double-Sided PCBAs

An article titled "3D X-Ray Inspection Provides Quality Check of Double-Sided PCBs" by GOEPEL's Andreas Tuerk, published in he March 2013 issue of US Tech, briefly explains how 3D X-Ray Inspection enables superior quality checks of double-sided printed circuit board assemblies (PCBAs). Specific topics discussed in the article include digital tomosynthesis, component libraries, and PCB warping.

Download the article to read more, or visit our website for more information about automated x-ray inspection.