A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z

 

A

ABM - Analog Boundary Module
AC - Alternating Current
ADC - Analog to Digital Converter
AOI - Automated Optical Inspection
ASIC - Application-Specific Integrated Circuit
ATAP - Analog Test Access Port
ATE - Automated Test Equipment
AXI - Automated X-Ray Inspection

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B

BGA - Ball-Grid Array
BERT - Bit Error Rate Test(er)
BIST - Built-In Self Test
BPR - Bypass Register
BSC - Boundary Scan Cell
BScan - Boundary Scan
BSR - Boundary Scan Register
BSDL - Boundary Scan Description Language
BST - Boundary Scan Test

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C

CAD - Computer Aided Design [Data]
CCA - Circuit Card Assembly
cJTAG - Compact JTAG
COB - Chip On Board
CPI - Central Processing Unit
CPLD - Complex PLD

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D   

DAC - Digital to Analog Converter
DC - Direct Current
DOF - Depth of Field
DR - Data Register
DRAM - Dynamic RAM
DSP - Digital Signal Processor
DTS - Debug and Test System
DUT - Device Under Test

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E   

EBST - Embedded Boundary Scan Test
EEPROM - Electrically Erasable Programmable Read-Only Memory
ESA - Embedded System Access

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F

 FCR - False Call Rate
FF - Flip-Flop
FIFO - First-In / First-Out [Memory]
FOV - Field of View
FPGA - Field-Programmable Gate Array
FPT - Flying Probe Test(er)
FT - Functional Test(er)

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I

 I2C - Inter-Integrated Circuit [Bus]
IEEE - Institute of Electrical and Electronics Engineers
IC - Integrated Circuit
ICE - In-Circuit Emulation
ICP - In-Circuit Programming
ICT - In-Circuit Test
I/F - Interface
IJTAG - Internal JTAG
I/O - Input/Output
IP - Intellectual Property
IR - Instruction Register
ISC - In-System Configuration
ISP - In-System Programming

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J

Jam - Predecessor to STAPL
JTAG - Joint Test Action Group

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L

LAN - Local Area Network
LASER - Light Amplification by Stimulated Emission of Radiation
LED - Light Emitting Diode

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M

μC - Micro-Controller
LAN - Local Area Network
LIN - Local Interconnect Network
LXI - LAN Extensions for Instrumentation
MCM - Multi-Chip Module
MCU - Micro-Controller Unit
MDA - Manufacturing Defect Analyzer
μP - Micro-Processor
MP - Megapixel
μW - Micro-Wire [Bus/Protocol]

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O

OCE - On-Chip Emulation
OCR - Optical Character Recognition
OCV - Optical Character Verification
OOI - Object of Interest

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P

PCA - Printed Circuit Assembly
PCB - Printed Circuit Board
PCBA - Printed Circuit Board Assembly
PCI - Peripheral Component Interconnect
PLD - Programmable Logic Device
PTH - Plated-Through Hole
PWM - Pulse-Width Modulation
PXI - PXI Extensions for Instrumentation

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Q

QFN - Quad Flat No leads (package)

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R

RAM - Random Access Memory

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S

SDRAM - Synchronous DRAM
SCITT - Static Component Interconnection Test Technology
SOC - System On Chip
SIP - System In Package
SJTAG - System JTAG
SPI - Serial Peripheral Interface [Bus]
SMD - Surface Mount Device
SMT - Surface Mount Technology
SPC - Statistical Process Control
SPI - Solder Paste Inspection
SRD - Scan Router Device
STAPL - Standard Test And Programming Language (Jedec Std. 71)
SVF - Serial Vector Format

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T

TAP - Test Access Port
TBIC - Test Bus Interface Circuit
TCK - Test Clock
TDI - Test Data Input
TDO - Test Data Output
THT - Through-Hole Technology
TMS - Test Mode Select
TRST - Test Reset (low active)

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U

 USB - Universal Serial Bus
UUT - Unit Under Test

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W

WLAN - Wireless LAN

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X

 XBST - External Boundary Scan Test

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