Multi Line
A common platform for a wide range of inspection tasks in the electronics manufacturing process:
solder / sinter paste inspection (SPI),
3D AOI applications for SMT,
2D and 3D AOI applications for THT,
conformal coating inspection (CCI).
With a common base system configuration, automated return of assemblies via a lower-level transport conveyor, optional double-sided inspection, and a common software platform, Multi Line provides tremendous flexibility.
Multi Line - SPI
Multi Line can be configured as a 3D inline system for the inspection of solder and sinter paste.
The telecentric 3D measurement head is used for shadow-free inspection of solder and sinter paste to verify shape, area, coplanarity, height, bridges, and offset.
X/Y resolution of 15 µm and Z-resolution of 0.2 µm enable precise and reproducible 3D measurement values.
Available plug-ins include:
link to your MES system,
closed-loop link to paste printer,
HERMES and IPC-CFX interfaces.
SPI result data can be combined with result data from AOI and AXI systems, facilitating failure root cause analysis and process monitoring.
Multi Line - SMT
Compared to other inspection systems, Multi Line offers a decisive advantage thanks to the use of double-sided 3D inspection technology. SMT assemblies can be fully inspected in a single pass using the AOI system after they have been fully assembled, without the need to turn them over. Both sides are inspected simultaneously, resulting in a significant test time reduction during the manufacturing process.
Three available system configurations include:
3D inspection of the assembly top side,
Simultaneous, double-sided 3D inspection of both sides of the assembly, and
3D inspection of the bottom side of the assembly
Maximum 3D measurement height in Multi Line is 35 mm, with 1 µm Z-resolution and 40 mm clearance.
The system’s PILOT AOI Version 7 system software includes fully automated test program creation and many other innovative and user-friendly features.
Multi Line - THT
Multi Line can put its flexibility on full display when inspecting THT assemblies. Different camera modules can be used for 3D measurements or for the inspection of very tall components. The system allows transport with or without carriers and offers return transport of assemblies in the lower part of the system.
Multi Line also enables 3D solder joint inspection of THT assemblies during return transport.
This wide range of configuration and integration variants allows Multi Line to be customized to fit your specific process and your production line layout.
For THT component inspection the system can be configured with four to eight angled-view cameras and a telecentric orthogonal camera, supporting inspection height of up to 80 mm and clearance of 140 mm.
For 3D THT component and solder joint inspection, the system provides Z-resolution of 1 µm and measurement height up to 35 mm, with top side clearance of 110 mm and bottom side clearance of 40 mm.
Multi Line - CCI
Multi Line CCI features a high-resolution color camera with telecentric optics for highly detailed images. UV (ultraviolet) illumination from above and from the side causes the fluorescent particles in the coating to glow, revealing defects, such as scratches or bubbles, and whether there is too much or too little coating on the respective assembly, according to the specifications of a coating plan.
Multi Line CCI can inspect conformal coatings either from above or below. Simultaneous double-sided inspection is also possible.
The system is configured with color camera with telecentric optics and a field of view of 44 mm by 44 mm. Illumination is provided from the top and from the side via UV, white, and red light. As with all Multi Line systems, a return transport option can be integrated in the lower part of the system.
Multi Line Assist
Complementing our inline inspection systems, Multi Line Assist is a smart automatic optical inspection module for integration in THT assembly lines.
The system concept using a 47 megapixel image acquisition unit, combined with a flexible LED illumination system, enables high-quality, high-resolution image capturing and allows real-time monitoring of manual assembly steps.
Optionally, an integrated laser projector enables user-guided assistance during placement by projecting information into the operator's field of view.
Selective Line 3D
Our Selective Line 3D is a powerful AOI integration module for the inspection of a selective set of solder joints - available with 2D or 3D imaging technology.
Based on the modular design of the camera and lighting head, Selective Line 3D can be integrated in the periphery of selective soldering systems.
